Unlike traditional FR-4 or aluminum substrates, ceramic substrates have a coefficient of thermal expansion close to that of semiconductors and high heat resistance, making them suitable for products with high heat generation (high brightness LEDs, solar energy).
Comparison of three types of ceramic materials for manufacturing ceramic substrates
I. Al2O3
So far, alumina substrates are the most commonly used substrate materials in the electronics industry because of their mechanical, thermal, and electrical properties compared to most other oxide ceramics, high strength and chemical stability, and abundant sources of raw materials, suitable for a variety of technical manufacturing and different shapes.
II.BeO
has a higher thermal conductivity than metallic aluminum, used in applications requiring high thermal conductivity, but the temperature exceeds 300 ℃ rapidly decreases, most importantly, due to its toxicity limits its own development.
III. AlN
AlN has two very important properties: a high thermal conductivity and an expansion coefficient that matches that of Si. The disadvantage is that even a very thin oxide layer on the surface can have an impact on the thermal conductivity, and only strict control of the material and process can produce a consistent AlN substrate.
The current large-scale AlN production technology is still immature, and the price of AlN is relatively high compared to Al2O3, which is also a bottleneck limiting its development. Comprehensive reasons, we can know, alumina ceramics due to the superior comprehensive performance, in the current microelectronics, power electronics, hybrid microelectronics, power modules and other fields are still in a dominant position and are used in large quantities.
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